PRODUCTS
토토 사이트 꽁 머니echnology
Decoration Materials
토토 사이트 꽁 머니lm Circuit Substrate
- 토토 사이트 꽁 머니lm Circuit Substrate with Precious Metal design guidance
- 토토 사이트 꽁 머니echnology
- New Copper Conductors + Plating Substrate design guidance
- 토토 사이트 꽁 머니lm Circuit Substrate with Copper Conductors design guidance
- 토토 사이트 꽁 머니lm Heater design guidance
Gypsum
Porous ceramic component
Ceramic cores
토토 사이트 꽁 머니hick Film Manufacturing Technology
Gold-plated Printed Substrates
Printed circuit substrates with silver conductor traces can be plated with gold
This results in excellent soldering and wire bonding characteristics
Long-length Substrates
토토 사이트 꽁 머니lm circuits can be formed on ceramic substrates up to 310 mm in length
Substrate size: 310 mm × 95 mm maximum
Fine Line Printing
Minimum lines and spacing: 50 μm / 50 μm
Castellation
Circuit substrates can be castellated to support surface mount devices
Via-filling Substrates
Via-filling substrates can handle higher current levels than ordinary through-hole substrates
They are also effective in raising heat dissipation with thermal vias
